No Clean Low Temp SMT Solder Paste

Basic Info

Model NO.	Solder Paste
Application	SMT
Manufacturing Method	Smelting
Alloy	Lead Free
Powder Size	Type 3: 25 to 45 Microns
Powder Size 2	Type 4: 20 to 38 Microns
Flux	No Clean Flux
Alloy 2	Sac305 Sn96.5AG3.0cu0.5
Alloy 3	Sac0307 Sn99AG0.3cu0.7
Alloy 4	Sn42bi58 Low Temperature
Certificate	RoHS
Packing	Jar
Packing 2	Syringe
Shipping	Courier / Air Freight
Shelf Life	6months
Storage	0 to 10 Degree Celsius
Application 2	SMD
Transport Package	Foam Box
Specification	100g to 1000g
Trademark	XF Solder
Origin	China
HS Code	3810100000
Production Capacity	30tons/Month

Product Description

We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

No Clean Low Temp SMT Solder Paste, manufacturer of No Clean Low Temp SMT Solder Paste, each packing of No Clean Low Temp SMT Solder Paste is 500g and we have foam box to put No Clean Low Temp SMT Solder Paste. This No Clean Low Temp SMT Solder Paste has been exorrted to many different countries and area and win good feedbacks among customers. We offer good quality and competitive price for No Clean Low Temp SMT Solder Paste. This No Clean Low Temp SMT Solder Paste is suitable to be used for Surface mounting printing, or hot air gun soldering. And we recommend No Clean Low Temp SMT Solder Paste to be shipped by air or courier, so that is can remains in good shape. We have much experience in the manufacturing of No Clean Low Temp SMT Solder Paste.

Basic information of Low Temperature Lead Free Solder Paste Sn42Bi58:

Composition: Sn42Bi58, tin & bismuth

Powder size: Type 3, 25 to 45 microns. Other powder sizes available upon request.

Flux: No clean type (about 11.5%)

Melting Point: 138ºC (low melting point)

Packing: Jar or Syringe.

Weight: 200g/jar, 500g/jar, 1000g/jar, 2000g/jar or other weight as per customers' requirements.

Color & Appearance of Paste: Metallic grey paste form.

Applications of Low Temperature Lead Free Solder Paste Sn42Bi58:

Solder Paste Sn42Bi58 is used for SMT (surface mount technology) of PCB assembly, BGA etc, especially suitable for soldering of temperature sensitive IC. Some IC (electronic components) are easy to damage when soldering temperature is high, to avoid such damage, low melting solder is needed. Lead free solder paste Sn42Bi58 has low melting point at 138ºC that can meet such requirements. Solder paste Sn42Bi58 can be soldered either through hot air gun manual soldering or reflow oven.

Feature of Low Temperature Lead Free Solder Paste Sn42Bi58:

1. Low melting point at 138ºC, much lower compares to tin lead Sn63Pb37 solder at 183ºC or lead free Sn96.5Ag3.0Cu0.5 solder at 217ºC.

2. Good wetting property. Solder paste Sn42Bi58 is easy to melt & wet fast.

3. No clean flux. The residue of Solder Paste Sn42Bi58 after soldering is non corrosive and transparent, in most general applications there is no need to do cleaning.

4. Long tack time with stable viscosity during the continuous printing process.

5. Lead free, compliant to ROHS & REACH.

Using & Storage of Low Temperature Lead Free Solder Paste Sn42Bi58:

1. Store Low Temperature Lead Free Solder Paste Sn42Bi58 in refrigerator at temperature between 0 to 10ºC to keep the paste in stable quality.

2. Low Temperature Lead Free Solder Paste Sn42Bi58 must be taken out of the refrigerator at least 3 to 6 hours prior to use, so that it has enough time to turn to thermal equilibrium with the environment. Best ambient temperature will be 20 to 25ºC when conducting the soldering project.

3. We recommend using out the Solder Paste Sn42Bi58 after the jar is open each time. After opening the jar, solder paste should be gently mixed for at least one minute with a spatula. In case there's still leftover paste after use, it must be tightly sealed and refrigerated. Before re-using, it's a must to double check if the solder pastes hasn't become separated or thicken to its usual state.

4. Read TDS of lead free solder paste Sn42Bi58 before using.