Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics

We produce differenty types of solder paste: Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc Lead

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Basic Info

Model NO.	Solder Paste
Condition	New
Alloy	Lead Free
Powder Size	Type 3: 25 to 45 Microns
Powder Size 2	Type 4: 20 to 38 Microns
Flux	No Clean Flux
Alloy 2	Sac305 Sn96.5AG3.0cu0.5
Alloy 3	Sac0307 Sn99AG0.3cu0.7
Alloy 4	Sn42bi58 Low Temperature
Certificate	RoHS
Packing	Jar
Packing 2	Syringe
Shipping	Courier / Air Freight
Shelf Life	6months
Storage	0 to 10 Degree Celsius
Application	SMT
Application 2	SMD
Transport Package	Foam Box
Specification	100g to 1000g
Trademark	XF Solder
Origin	China
HS Code	3810100000
Production Capacity	30tons/Month

Product Description

We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Syringe Jar IC Reballing Low Temperature Sn42bi58 Silver Bearing Sac305 BGA SMD SMT PCB Reflow Soldering Lead Free Tin Rosin Flux Solder Paste for Electronics

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